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Custom Size Fused Silica Round Optical Window
Round fused silica plates for semiconductor applications, customizable thickness, high clarity, and suitable for wavelengths <400 nm.
Core attributes
- Material
- Fused Silica
- Shape
- round
- Thickness
- 0.3–100 mm
Product facts
Key attributes
- Material
- Fused Silica
- Shape
- round
- Thickness
- 0.3–100 mm
Product description
This round fused silica plate is designed for applications in the semiconductor industry, particularly effective for wavelengths below 400 nm. Its high clarity and polished surface quality (60/40) make it suitable for optical communication and other precision applications. The plate can be customized in thickness from 0.3 mm to 100 mm, accommodating various project requirements.
Key Features
- Material: Fused Silica for high durability and thermal stability.
- Thickness range: 0.3 mm to 100 mm, allowing for versatile application needs.
- Surface quality: 60/40, ensuring clarity for optical applications.
- Processing options available: Bending, punching, cutting, and molding for custom designs.
- High work temperature: Up to 1100°C, suitable for demanding environments.
Applications
Semiconductor
Specification Summary
| Item | Value |
|---|---|
| Material | Fused Silica |
| Shape | Round |
| Diameter | Custom |
| Thickness | 0.3 mm |
| Surface Quality | 60/40 |
| Transmission bands | UV (<400 nm) |
| MOQ | — |
Full Specifications
| Parameter | Value |
|---|---|
| Clarity Type | Clear Quartz Plate |
| Processing Service | Bending, Punching, Cutting, Moulding, Support Custom, Fine plate OD320*26 |
| Color | Clear Transparent |
| Surface | Polished Treatment |
| Density | 2.2g/cm3 |
| Work Temperature | 1100 |
| Soften Point | 1730C |
FAQ
Can I get custom sizes?
Yes, the fused silica plates can be customized in thickness from 0.3 mm to 100 mm.
What is the minimum order quantity (MOQ)?
The MOQ is not specified, allowing for flexible ordering.
Product inquiry
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